Key Features
- 8.7 x 8.7 x 9.8″ Build Volume
- 100 – to 400-Micron Layer Resolution
- Single Modularized Nozzle
- Uses 1.75mm Filament
- PLA, TPU & PETG Filament Support
- Enhanced User Interface
- Heated Glass Platform
- Streamlined Assembly
- V-Guide Rail System
- Self-Developed Silent Motherboard













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